In April 2018, cpu heat sink based on porous copper microchannel material was developed by Tsinghua University Materials Institute. In this study, the key process and stability control of large size (diameter 100-200mm, high 200-250mm) and large aspect ratio (> 100mm) lotus root shaped porous copper were obtained. The key process and stability control of cold head welding and high thrust and low noise liquid metal drive of CPU heat dissipation engineering prototype were obtained. Key technologies such as pump manufacturing, The pilot-scale development of cpu radiator based on lotus root porous copper microchannel material is completed, and the demonstration application is realized.

一、 the industry market scale increases year by year

Heat sink is an indispensable and important part of power electronic components. As long as the heat sink industry can keep up with the development of power electronic components, it can continuously make breakthrough innovations in heat dissipation materials and media, structure and process, so long as the heat sink industry can keep pace with the development of power electronic components. The life cycle of the industry will not fluctuate significantly。

二、 Further expansion of downstream applications will lead to further development of the industry

During the 13th Five-Year Plan period, the application scope of radiator subdivision products such as cpu radiator, automobile radiator (especially new energy automobile), ICC, electric energy and so on will continue to expand. In the next few years, China's radiator industry will maintain a growth rate of about 7-10 percent driven by these subdivisions, and the market size of the radiator industry will reach 219.9 billion yuan by 2023.